IAAI16@Technion – The Israeli Association for Artificial Intelligence Symposium – 26/10/2016

Call for Papers and Participation

The annual symposium of the Israeli Association for Artificial Intelligence (IAAI) will be held on Wednesday, October 26th, 2016, at the Technion – Israel Institute of Technology (note that the previous IAAI at BGU was held on January 2016, so the current event will be referred to as IAAI16-Technion).

IAAI aims to promote and sponsor activities involving the community of Artificial Intelligence (AI) researchers in Israel from academia and industry. The annual IAAI symposium aims at bringing together researchers and practitioners in the different fields of Artificial Intelligence (AI) in the spirit of increasing the cohesiveness of the Israeli AI research community.

The program this year will focus on orientation for research students, and will include a panel on future career opportunities with representatives from big industry, startups, academia, and more. There will be several technical talks by invited speakers from industry and academia.

There will be no contributed talks this year, but students are encouraged to submit papers for presentations as posters. These papers can be either work in progress, in submission, or recently published. We particularly welcome papers regarding applications of AI research to problems in medicine, education, and social planning.

Papers will be lightly reviewed for relevance and general fit. No special format is required, and there will be no published proceedings.

Students wishing to present a poster can submit their papers by email to iaai16.technion@gmail.com. This is an excellent opportunity to get some feedback before submitting papers elsewhere.

Please Register (free but required).

Important Dates:

Paper submission deadline: September 29, 2016 (extended)

Paper notification deadline: September 30, 2016

Registration deadline: October 6, 2016

Conference: October 26, 2016

For further information, contact one of the organizers:

Sponsorship

Generously supported by the Techion and the Technion-Microsoft Electronic-Commerce Research Center